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产品名称：BM23FR 系列
0.35mm Pitch, 0.6mm & 0.8mm Stacking Height, FPC to Board Connectors
1. Space saving: 0.35mm pitch, 0.6mm& 0.8mm stacking height, 1.98mm depth
2. Robust structure with metal fittings
3. Large vacuum pick & place area configured in space with 1.98mm depth
4. Clear tactile click
5. Highly reliable 2-point contact and retention force with clipping contact design
6. Supports USB 3.1 gen.2 (10Gbps) transmission
7. Solder wicking prevention
8. Contact protection against dust
1. Space saving: 0.35mm pitch, 0.6mm& 0.8mm stacking height, 1.98mm depth
2. Robust structure with metal fittings
3. Large vacuum pick & place area configured in space with 1.98mm depth
4. Clear tactile click
5. Highly reliable 2-point contact and retention force with clipping contact design
6. Supports USB 3.1 gen.2 (10Gbps) transmission
7. Solder wicking prevention
8. Contact protection against dust
规格说明
- 连接器类型
- 插头, 插座
- 部件部分
- 参考规格
- 安全规格
- 传输规格
- 传输速度
- 开口间距
- 0.35 mm
- 安装间距
- 0.35 mm
- (mm)宽度
- 嵌合高度(Min.)
- 0.6, 0.8 mm
- 嵌合高度(Max.)
- 0.6, 0.8 mm
- 嵌合高度
- 0.6, 0.8 mm
- PIN数
- 6, 8, 10, 12, 16, 18, 20, 24, 30, 34, 40, 50, 60
- 其他PIN数
- 浮动设计
- 插拔次数
- 10
- 安装方法
- SMT
- 开口方向
- 笔直
- 接触部电镀
- 金
- 额定电流
- 0.3 A
- (AC)额定电压
- AC 30.0 V
- (DC)额定电压
- DC 30.0 V
- (Max.)使用温度范围
- 85 ℃
- (Min.)使用温度范围
- -55 ℃
产品数据
产品分类
产品中心 / Product Center
